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TITAN & TITAN NITRO Wave Solder Machine
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TITAN |
TITAN NITRO |
| Control System |
Complete Dell configured computer control system |
| PCB Specifications |
Max. Length: 30"±0.75",
Max. Width: 450 mm (18"), Angle: adjustable between 4?7° |
| Conveyor System |
Titanium finger conveyor
with input board guides, finger cleaner, and (optional) center board support . Computer controlled adjustable speed from 4"-80"/ min |
| Pre-heating Zone |
Three Forced Air Convection
bottom Pre-heaters, Total length:1800mm (70"), Two Topside
Reflectors, Temperature range adjustable from room temperature to 230°C |
| Lead-Free Solder Pot |
Complete Titanium Dual Wave,
Roll Out Solder Pot. Temperature range adjustable from room temperature to 350°C |
| Internal Spray Fluxer |
Computer controller pressure: 5-6kgf/cm?nbsp; and flow rate: 10-100ml/min, Capacity Approx: 20 liters |
| Nitrogen Consumption |
N/A |
Consumption of Nitrogen, 15-30 m?/hour With an O?
density of 200-800 ppm |
| Solder Pot Capacity |
Approximately 400kg(1,000 1bs) |
| Power Consumption |
Approximately 8 KvA during normal running conditions and 30 KvA at full load Start-Up |
| Power Supply |
3 phase, 5 wires, 380V, 50/60Hz standard, Also configured to 208-220 or 440-480 Volt US |
| Outside Dimension |
Length - 4300 mm x Width - 1350 mm x Height - 1720 mm |
| Options |
External Nitrogen Cooler for enhanced Nitrogen savings and performance |
| Specifically designed for the Lead-Free Process: |
1. The conveyor system comes standard with a
left-to-right configuration. It also offers an automatic mode which
detects the PCB location, utilizing input sensors and automatically turns the internal spray fluxer and solder
pot waves on as the PCB approaches, then shuts them off after the PCB passes. This allows for optimum
performance and efficiency of the entire system.
The conveyor system comes standard with a finger cleaner
that incorporates a recirculation pump for the IPA (isopropyl alcohol) to efficiently return the fingers to their
optimum condition.
The Titan series comes standard with an adjustable titanium center support for panelized
and larger boards.
2. The standard conveyor also comes with a finger type rail made up of the same anti-corrosion titanium alloy for
the fingers as used in the solder pot. It comes standard with flexible type fingers and can be upgraded to a
clasp type conveyor system. The conveyor speed is adjustable between
4 to 80"/min.
3. The standard internal spray flux module consists of a reciprocating spraying action controlled by a reliable
stepper motor drive system. The spraying area and time are adjusted automatically with the width and
speed of the PCB sensed by the input sensor and the input conveyor speed.
An air knife provides
sweeping action after the fluxing stage prior to the preheat section.
4. Included with the system is an external
exhaust filter and vent preventing flux gases from entering the
facility exhaust system.
5. The Pre-heat
system consists of three flat, hot air, forced convection, heating
plates. These pre-heaters easily conform to the standard activation
temperatures for both leaded and lead-free processes (leaded flux
process = 90-105°C; lead-free flux process = 120-140°C). The close
proximity of the final pre-heater to the solder pot minimize thermal
shock as the circuit board makes contact with the solder.
6. The dual wave solder pot is made entirely of anti-corrosion titanium alloy. The dual wave system consists of
both a standard type laminar flow wave as well as a turbulent, vibrating surface mount wave. All internal parts,
including hardware, are made from this anti-corrosion titanium alloy. This titanium alloy also allows for lower
solder oxidation within the solder pot thus reducing the dross. The solder pot is also designed to automatically
direct the solder dross to an easily removed location.
7. The Titan series includes a post solder pot cooling system designed to bring the PCB back to room
temperature within a controlled environment.
8. The nitrogen option, Titan Nitro, prevents PCB and solder oxidation as well as enhancing the wetability and
cosmetic of the solder joints with the lead-free process. The Titan
Nitro comes standard with a re-circulating cooling system to enhance
the nitrogen performance and reduce Nitrogen consumption. |
| Titan & Titan Nitro Series Operating System: |
Windows 2000 operating system has powerful functions with convenient operation.
Proportional Integral Derivative (PID) closed loop controls for solder pot temperature and conveyor speed.
Safety alarms for solder pot and preheat temperature, conveyor speed and jam, PCB board tracking and low solder level.
Stores up to 1000 independent process recipes including conveyor speed, spray fluxer parameters, preheat and solder pot temperatures.
The Titan comes standard with 3 temperature thermocouple ports and
profile graphing software to verify solder profile. |
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